Here, it’s best to set high temperatures so that the joints come out as desired.Ĥ.
Soldering phase –this phase needs to witness the temperature of solder joints rising to that of the soldering temperature. Soaking phase – here, the target is to achieve hot melting, something that makes good soldering joints.ģ. For this reason, there are no instances of solder splashing or an overheated base.Ģ. Here, the temperatures can go as high as 150℃ in under 2 minutes. Preheating phase –this phase is usually composed of 2 to 4 zones of heating. Reflow technology soldering is a complicated process that involves a couple of phases, as briefly highlighted below:ġ. After that, subject the BGA components through a reflow soldering oven. Secondly, you introduce the pick-and-place equipment to align BGA components on the PCB.
First, solder paste gets printed on a pad array of a PCB by applying stencil or flux onto the pad. Typically, the assembly package of BGA is the same as the SMT assembly. Additionally, BGAs need about 30 minutes of cooling after baking and before entering the SMT assembly line.īGA soldering, Reflow Technology soldering It ensures the elimination of moisture inside the BGA. So, it’s essential to bake components before undertaking the SMT assembly. Again, caution is essential here since if the temperature is low, it becomes hard to get rid of moisture. Otherwise, it may bring about an undesirable metallographic structure. Here, manufacturers need to ensure that the soldering temperature doesn’t exceed 125℃. The temperatures should range between 20℃ to 25℃ and a humidity of approximately 10%.Īs noted earlier, there’s a need to bake BGA components before starting the soldering process. In general, though, these components should be kept inside moisture buster cabinets. Those in charge of handling them must conform to the rigorous operations required to keep the components from damage. Since BGAs are moisture-sensitive in a way, you need to ensure that you keep them in a dry environment.
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